Institute of Application Specific Integrated Circuits

The Institute of Application Specific Integrated Circuits became a member institute of JITRI in January 2014. It established an independent legal entity named Wuxi Institute of Integrated Circuits (Southeast University) in January 2015, which was supported by Southeast University and Wuxi High-Tech Zone. The Institute of Application Specific Integrated Circuits is mainly engaged in research and development work in three directions: intelligent power integrated circuits, wide voltage range integrated circuits, and research on IoT chip and application technology. It now has staff of 279 and more than 17000m2 of lab and office space. The Institute also has research equipment of RMB60 million, including Probe Station and Emission Microscopy etc. The main achievements include intelligent power driver chips and modules, key research of high performance of near threshold integrated circuits, reconfigurable security algorithm and tool chain design, etc. Since its establishment, the institute has allocated a total of 190 million yuan in government funding and 290 million yuan in corporate cooperation funds, providing a total of 197 enterprises with technical services; applied for 674 patents and authorized 511 patents; and won 9 provincial and ministerial-level invention awards. The Institute also actively carries out personnel training, technological achievement transfer, industrial strategy research, etc., focusing on building integrated circuit technology research and service platforms to support the technological progress, transformation and upgrading of Jiangsu's integrated circuit industry.

Institute of Advanced Packaging

The Institute of Advanced Packaging was founded in September 2012, which became a member institute of JITRI in September 2015, converted to formal research institute in February 2017. The Institute’s current research directions include: 2.5D/3D TSV and integration technologies (including TSV, bumping, via-reveal and chip-stacking), high density wafer level packaging, SiP product application and development, and verification and development of related advanced materials and equipment for microelectronics packaging. The institute was approved to build the national innovation center of characteristic technology of integrated circuit and packaging test, and it was approved to set up a national post-doctoral research workstation. And the annual production capacity "25 million advanced packaging and system integration transformation projects" was officially launched, and construction began at the end of December.

Institute of Intelligent Integrated Circuit Design Technology

On June 21, 2019, the Intelligent Integrated Circuit Design Technology Research Institute of Jiangsu Industrial Technology Research Institute (hereinafter referred to as the "Research Institute") was formally established. R&D direction revolves around chip design and integrated circuit public services. After more than a year of construction, the Institute has gathered a group of high-level talents from Tsinghua University, Chinese Academy of Sciences and other well-known universities and institutes, and formed a talent team of more than 120 people, of which more than 70% of R&D personnel; obtained a batch of chip technology and product research and development Achievements, applied for more than 30 patents, including nearly 20 invention patents. Products such as 4K high-speed display chips and smart digital hearing aid chips have reached advanced levels and have been tried by users; the institute has established and operated a national core-fire dual innovation base to provide core machines Services such as docking, MPW tape-out, IP/SoC, testing and analysis, talent training, EDA, etc., led the successful bidding of the "Core Fire" dual innovation platform project for the integrated circuit industry of the Ministry of Industry and Information Technology; Incubating nearly 20 innovative and entrepreneurial teams and enterprises.

Institute of Future Networks Technology

Together with Nanjing Future Network Industry Innovation Co..Ltd. (FNIC), FNII bacame a member institute of JITRI in September 2015 as Institute of Future Networks. The research and development direction includes new network architecture and innovative technology (SCN, SOFIA, SFA, SDN, NFV, ODL, ONOS, etc.), content delivery network (CDN) technology, network big data, network awareness and operation and maintenance, cyberspace security, industrial Internet.In order to adapt to the new trend of future global network evolution, FNII proposed a new service-customized network architecture (SCN). Based on that, FNII took the lead to construct the national major scientific infrastructure – China Environment for Network Innovation (CENI). As of the end of 2020, a total of 27 optical transmission network core node equipment has been installed, and a total of 21 have been opened, covering more than 75% of provincial capitals and key cities. It is initially capable of external test services. In recent years, the institute has made major breakthroughs in key technology fields such as large-network-level network operating system and deterministic networks, annual income over 100 million yuan, and a total of more than 60 derivative incubators.

Institute of High Throughput Computing

In December 2019, the Institute of High Throughput Computing was established. It researches on development and application of high throughput computing technology, research and development of core chips, key sensors and driving systems for 5G networked vehicles, development of Smart City Platform. The Institute has built a high-throughput data room with a total scale of 1,000 nodes, which can provide high-throughput computing services to meet the actual needs of local industries, including data storage, analysis and processing, for the construction of intelligent "city brain", video big data processing, network security information processing, big picture computing, artificial intelligence. The company provides computing systems and component manufacturing technologies for intelligent "city brain" construction, video big data processing, network security information processing, big picture computing, artificial intelligence data processing, high concurrent IoT processing, etc. After achieving the world's first place in the Green Graph 500 large dataset and small dataset lists in December 2019, the innovation team of the Institute of High-Throughput Computing has carried out a lot of R&D work on the design of the ultra-large-scale graph computing framework. The "King Kong" high-throughput server was ranked number one in the world for both large and small data sets in the Green Graph 500 global rankings published in June 2020. The driverless vehicles independently developed by the Institute have already been used in a number of scenarios such as Daqing Oilfield, Beijing Metro, Yancheng Intelligent Terminal Venture Park, Zhengzhou Industrial Park and Jinan Radio and Television Park. It has been jointly landed and applied with scenarios such as smart security, smart property and smart scenic spots.

Brain-Machine Fusion Research Institute

The institute was established in July 2019, it has a research and development site with an area of about 1600 square meters and more than 40 team members. The institute has incubated and gathered 9 enterprises related to brain-computer fusion intelligence technology and artificial intelligence technology. The institute has applied for 65 kinds of intellectual property rights, including 20 invention patents, 11 utility models, 15 integrated circuit layout designs and 19 software Copyrights. By the end of 2020, the institute began to take shape, successfully became one of the new R&D organizations in Suzhou City. In the brain-machine interface algorithm chip developed by JITRI Brain-Machine Fusion Research Institute, a series of operations related to the induction paradigm, control parameters and calculation methods based on the Steady State Visual Evoked Potential (SSVEP) have been made into standards, procedures and software. By implementing algorithm software, the data analysis method and parameter selection could be constantly optimized through machine learning, and then the software could be transformed into the chip solution with high efficiency, low energy consumption, low cost and good compatibility. The R&D direction and purpose of the institute is to create a world-class supplier of key components and equipment for brain-computer fusion smart technology, a world's top one-stop system solution provider for brain-computer fusion smart application products, and a world-class service provider of brain-computer fusion-related biomedical engineering.

Institute of Integrated Circuit Technology